EP3SL200H780C2N vs EP3SL200H780I3 Perbandingan
Perbandingan bersamaan detil EP3SL200H780C2N dari Intel dan EP3SL200H780I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL200H780C2N | EP3SL200H780I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | 488 |
| Embedded Memory Bits | 10,901,504 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | — |
| Transceivers | Per family capability - not specified for this OPN | — |
| Paket | 780-ball HBGA / FCBGA | 780-BBGA, FCBGA (HBGA-780) |
| Package Code | PBGA780 / HBGA-780 | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | Commercial (0C to +85C) | -40C to +100C (Industrial) |
| Lead Free | Yes | — |
| Status RoHS | Compliant | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |