EP3SL200H780C2N vs EP3SL200H780I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL200H780C2N sa pamamagitan ng Intel at EP3SL200H780I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL200H780C2N | EP3SL200H780I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | Stratix III L | Stratix III |
| Logic Elements | 200,000 | 200,000 |
| Adaptive Logic Modules (ALMs) | 80,000 | — |
| User I/O Count | 488 | 488 |
| Embedded Memory Bits | 10,901,504 | — |
| Process Technology | 65 nm CMOS | 65 nm CMOS |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Internal Frequency | 800 MHz | — |
| Speed Grade | C2 | — |
| Transceivers | Per family capability - not specified for this OPN | — |
| Packhaging | 780-ball HBGA / FCBGA | 780-BBGA, FCBGA (HBGA-780) |
| Package Code | PBGA780 / HBGA-780 | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | Commercial (0C to +85C) | -40C to +100C (Industrial) |
| Lead Free | Yes | — |
| Tindminan RoHS | Compliant | — |
| Series | — | Stratix III L |
| LABs (Logic Array Blocks) | — | 8000 |
| Total RAM Bits | — | 10,901,504 (10,900 Kb) |
| Number of I/O Banks | — | [DATA_NEEDED: I/O banks] |
| Embedded Multipliers (DSP blocks) | — | 384 (18x18) |
| PLLs | — | 12 |
| Maximum Operating Frequency | — | 717 MHz |
| Supplier Device Package | — | 780-FBGA (29x29 mm) |
| Lead-Free / RoHS | — | Compliant (lead-free) |