EP3SL200H780I4 vs EP3SL200H780I4L Perbandingan

Perbandingan bersamaan detil EP3SL200H780I4 dari Intel dan EP3SL200H780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I4 EP3SL200H780I4L
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Series Stratix III L —
Family Stratix III Stratix III L
Logic Elements (LE) 200,000 —
Logic Array Blocks (LABs) 8000 8,000
Embedded Memory Bits 10,901,504 —
User I/O Count 488 —
DSP Multipliers (18x18) 384 —
Voltage - Core Supply 1.1 V —
Process Technology 65 nm CMOS 65 nm CMOS
Package Type 780-BBGA / FCBGA (FC-HFBGA) —
Package Dimensions 33 mm x 33 mm —
Speed Grade I4 (industrial) I4 (Industrial)
Suhu Hubung Kerja -40C to +100C (industrial) —
Configuration Memory SRAM-based, volatile —
Status RoHS Compliant Compliant
Design Tool Quartus II (legacy) / Quartus Prime —
Logic Elements — 200,000
Embedded Memory (Bits) — 10,901,504
Maximum User I/O — 488
Core Supply Voltage — 0.86 V to 1.15 V
Internal Performance — 375 MHz
Paket — 780-pin FC-HFBGA (Flip-Chip)
Tipe Mounting — Surface Mount
Suhu Kerja — -40C to +100C (Industrial)
Transceivers — Up to 24 channels
Transceiver Data Rate — Up to 6.375 Gbps
DSP Blocks — 9x9 / 18x18 / 36x36 multipliers
Memory Interface Support — DDR3, DDR2, DDR, QDR II+, RLDRAM II
JTAG Support — IEEE Std 1149.1 Boundary-Scan
HardCopy Support — Compatible (Lattice-style migration path via HardCopy III)

Spek dan Sumber

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