EP3SL200H780I4L vs EP3SL200H780I4LN Perbandingan

Perbandingan bersamaan detil EP3SL200H780I4L dari Intel dan EP3SL200H780I4LN dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL200H780I4L EP3SL200H780I4LN
Merek Intel Altera
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND NRND
Family Stratix III L Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (Bits) 10,901,504 —
Maximum User I/O 488 —
Core Supply Voltage 0.86 V to 1.15 V —
Process Technology 65 nm CMOS 65 nm CMOS
Internal Performance 375 MHz —
Paket 780-pin FC-HFBGA (Flip-Chip) —
Tipe Mounting Surface Mount Surface Mount
Suhu Kerja -40C to +100C (Industrial) -40C to +100C (industrial)
Transceivers Up to 24 channels —
Transceiver Data Rate Up to 6.375 Gbps —
DSP Blocks 9x9 / 18x18 / 36x36 multipliers —
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II —
JTAG Support IEEE Std 1149.1 Boundary-Scan —
Status RoHS Compliant RoHS Compliant (lead-free)
Speed Grade I4 (Industrial) I4 (Industrial, mid-speed grade)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
Paket / Case — 780-BBGA, FCBGA (Flip-Chip BGA)
Level MSL — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

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