EP3SL200H780I4L vs EP3SL200H780I4LN 比較

詳細並排比較 EP3SL200H780I4L 由 Intel 與 EP3SL200H780I4LN 由 Altera. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL200H780I4L EP3SL200H780I4LN
品牌 Intel Altera
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND NRND
Family Stratix III L Stratix III L (Low-Power)
Logic Elements 200,000 —
Logic Array Blocks (LABs) 8,000 —
Embedded Memory (Bits) 10,901,504 —
Maximum User I/O 488 —
Core Supply Voltage 0.86 V to 1.15 V —
Process Technology 65 nm CMOS 65 nm CMOS
Internal Performance 375 MHz —
封裝 780-pin FC-HFBGA (Flip-Chip) —
安裝類型 Surface Mount Surface Mount
工作溫度 -40C to +100C (Industrial) -40C to +100C (industrial)
Transceivers Up to 24 channels —
Transceiver Data Rate Up to 6.375 Gbps —
DSP Blocks 9x9 / 18x18 / 36x36 multipliers —
Memory Interface Support DDR3, DDR2, DDR, QDR II+, RLDRAM II —
JTAG Support IEEE Std 1149.1 Boundary-Scan —
RoHS 狀態 Compliant RoHS Compliant (lead-free)
Speed Grade I4 (Industrial) I4 (Industrial, mid-speed grade)
HardCopy Support Compatible (Lattice-style migration path via HardCopy III) —
Series — Stratix III L
Manufacturer — Intel / Altera (now Intel PSG)
Number of Logic Elements / Cells — 200,000
Number of LABs / CLBs — 8,000
Total RAM Bits — 10,901,504 (approximately 10.9 Mbit)
Number of I/O — 488
Voltage - Supply — 0.9 V core (selectable Vcore)
封裝 / 外殼 — 780-BBGA, FCBGA (Flip-Chip BGA)
MSL 等級 — MSL 3 (168 Hours, per JEDEC J-STD-020)
Roaming Pin Name Suffix — LN = lead-free, industrial temp, H780 780-ball package

資料表與資源

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