EP3SL50F484C3 vs EP3SL50F484C2G Perbandingan
Perbandingan bersamaan detil EP3SL50F484C3 dari Intel dan EP3SL50F484C2G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL50F484C3 | EP3SL50F484C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix III L | Stratix III L |
| Logic Cells | 47,500 cells | — |
| Technology | 65 nm | — |
| Listed Frequency | 500 MHz | — |
| Internal Frequency | 800 MHz | — |
| Tegangan Pemuat | 1.1 V | — |
| Logic Array Blocks | 1,900 LABs | — |
| User I/O | 296 I/Os | — |
| Paket | 484-pin FC-FBGA | 484-ball FCBGA (FBGA-484) |
| Jumlah Pin | 484 pins | — |
| Package Type | FBGA-484 | — |
| Suhu Kerja | 0 °C to 85 °C | — |
| Device Category | Programmable logic IC | — |
| Tipe Mounting | Surface Mount | — |
| Manufacturer Technology Description | 65-nm low-power high-performance FPGA | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory size] | — |
| Embedded Transceivers | [DATA_NEEDED: embedded transceiver count] | — |
| Power Consumption | [DATA_NEEDED: power consumption] | — |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 2,184,192 bits (2.08 Mbit) |
| Maximum User I/Os | — | 296 I/O |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Maximum Operating Temperature | — | +85 C |
| Minimum Operating Temperature | — | 0 C |
| Frekuensi Bawah Maximum | — | 600 MHz |
| Process Technology | — | 65 nm CMOS |
| Gaya Mounting | — | SMD/SMT |
| Packaging | — | Tray |
| Total Transceivers | — | [DATA_NEEDED: transceiver count] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |