EP3SL50F484C3 vs EP3SL50F484C2G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F484C3 disebabkan oleh Intel dan EP3SL50F484C2G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL50F484C3 | EP3SL50F484C2G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Family | Stratix III L | Stratix III L |
| Logic Cells | 47,500 cells | — |
| Technology | 65 nm | — |
| Listed Frequency | 500 MHz | — |
| Internal Frequency | 800 MHz | — |
| Tegangan Pemberi Arus | 1.1 V | — |
| Logic Array Blocks | 1,900 LABs | — |
| User I/O | 296 I/Os | — |
| Kemasan | 484-pin FC-FBGA | 484-ball FCBGA (FBGA-484) |
| Kiraan Pin | 484 pins | — |
| Package Type | FBGA-484 | — |
| Suhu Operasi | 0 °C to 85 °C | — |
| Device Category | Programmable logic IC | — |
| Jenis Pemasangan | Surface Mount | — |
| Manufacturer Technology Description | 65-nm low-power high-performance FPGA | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Halogen-Free Status | [DATA_NEEDED: halogen-free status] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory size] | — |
| Embedded Transceivers | [DATA_NEEDED: embedded transceiver count] | — |
| Power Consumption | [DATA_NEEDED: power consumption] | — |
| Logic Elements | — | 47,500 LE |
| Adaptive Logic Modules (ALMs) | — | 19,000 ALM |
| Embedded Memory | — | 2,184,192 bits (2.08 Mbit) |
| Maximum User I/Os | — | 296 I/O |
| Number of LABs/CLBs | — | [DATA_NEEDED: LAB count] |
| Operating Supply Voltage (Core) | — | 1.1 V |
| Maximum Operating Temperature | — | +85 C |
| Minimum Operating Temperature | — | 0 C |
| Frekuensi Klock Maksimum | — | 600 MHz |
| Process Technology | — | 65 nm CMOS |
| Gaya Pemasangan | — | SMD/SMT |
| Packaging | — | Tray |
| Total Transceivers | — | [DATA_NEEDED: transceiver count] |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |