EP3SL50F780I4L vs EP3SL50F780I4LG Perbandingan

Perbandingan bersamaan detil EP3SL50F780I4L dari Intel dan EP3SL50F780I4LG dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP3SL50F780I4L EP3SL50F780I4LG
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Stratix III L Stratix III L
Logic Elements 47,500 —
Embedded Memory (bits) 2,184,192 —
User I/O Count 488 488
I/O Banks 8 —
Paket 780-BBGA, FCBGA (29 mm) —
Process Technology 65 nm CMOS —
Core Voltage 0.9 V —
Suhu Kerja -40C to +100C (Industrial) —
Lead-Free / RoHS Yes (L suffix) —
Speed Grade I4 4
Tipe Mounting Surface Mount (BGA) —
Level MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Configuration Memory SRAM-based, volatile —
Design Suite Quartus II / Quartus Prime (Stratix III support) —
Device Sub-Family Low-Power (L) —
Country of Origin [DATA_NEEDED: COO not specified in source data] —
Series — Stratix III
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory — 2,184,192 bits (2.08 Mbit)
Tegangan Pemuat Kerja — 1.1 V
Package Type — 780-BBGA, FCBGA (flip-chip)
Gaya Mounting — SMD/SMT
Rentang Suhu Kerja — -40C to +100C (Industrial)
Lead-Free — Yes
Status RoHS — Compliant
Configuration Method — JTAG / Active Serial (AS)
Design Software — Quartus II (Altera/Intel)
Sub-Family — Low-power (L) variant
Process Node — [DATA_NEEDED: process node]
Number of Transceivers — [DATA_NEEDED: transceiver count]
DSP Blocks — [DATA_NEEDED: DSP block count]

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