EP3SL70F780I3G vs EP3SL70F780I3N Perbandingan
Perbandingan bersamaan detil EP3SL70F780I3G dari Intel dan EP3SL70F780I3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL70F780I3G | EP3SL70F780I3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| Adaptive Logic Modules (ALM) | 27,000 ALM | — |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) | — |
| User I/Os | 488 | 488 |
| Paket | 780-BBGA, FCBGA (29x29 mm) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Core Voltage (VCCINT) | 1.1 V | — |
| Suhu Kerja | -40C to +100C (Industrial) | — |
| Process Technology | 40 nm TSMC | 65 nm CMOS |
| Tipe Memori | SRAM-based, external configuration | — |
| DSP Blocks | Multipliers, count varies by die | — |
| Configuration | External (EPCS / JTAG) | SRAM-based, volatile |
| Status RoHS | Compliant | Compliant (per distributor listings) |
| Packaging | Tray | — |
| Speed Grade | 3 (Medium) | I3 (industrial) |
| Logic Elements | — | 67,500 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| Core Voltage | — | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Suhu Hubung Kerja | — | -40 C to +100 C |