EP3SL70F780I3G vs EP3SL70F780I3N 比較

詳細並排比較 EP3SL70F780I3G 由 Intel 與 EP3SL70F780I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SL70F780I3G EP3SL70F780I3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND 啟用中
Family Stratix III L Stratix III L
Logic Elements (LE) 67,500 —
Adaptive Logic Modules (ALM) 27,000 ALM —
Embedded Memory 2,699,264 bits (2.57 Mbit) —
User I/Os 488 488
封裝 780-BBGA, FCBGA (29x29 mm) —
安裝類型 Surface Mount Surface Mount
Core Voltage (VCCINT) 1.1 V —
工作溫度 -40C to +100C (Industrial) —
Process Technology 40 nm TSMC 65 nm CMOS
記憶體類型 SRAM-based, external configuration —
DSP Blocks Multipliers, count varies by die —
Configuration External (EPCS / JTAG) SRAM-based, volatile
RoHS 狀態 Compliant Compliant (per distributor listings)
Packaging Tray —
Speed Grade 3 (Medium) I3 (industrial)
Logic Elements — 67,500
Logic Array Blocks (LABs) — 2,700
Embedded Memory (bits) — 2,699,264
Core Voltage — 1.1 V (1.05 V to 1.15 V)
Operating Frequency — 500 MHz
Package Type — 780-BBGA, FCBGA (Flip-Chip FineLine BGA)
Ball Pitch — 1.0 mm
工作接面溫度 — -40 C to +100 C

資料表與資源

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