EP3SL70F780I3G vs EP3SL70F780I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I3G sa pamamagitan ng Intel at EP3SL70F780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP3SL70F780I3G | EP3SL70F780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Stratix III L | Stratix III L |
| Logic Elements (LE) | 67,500 | — |
| Adaptive Logic Modules (ALM) | 27,000 ALM | — |
| Embedded Memory | 2,699,264 bits (2.57 Mbit) | — |
| User I/Os | 488 | 488 |
| Packhaging | 780-BBGA, FCBGA (29x29 mm) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Core Voltage (VCCINT) | 1.1 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Process Technology | 40 nm TSMC | 65 nm CMOS |
| Uri ng Memory | SRAM-based, external configuration | — |
| DSP Blocks | Multipliers, count varies by die | — |
| Configuration | External (EPCS / JTAG) | SRAM-based, volatile |
| Tindminan RoHS | Compliant | Compliant (per distributor listings) |
| Packaging | Tray | — |
| Speed Grade | 3 (Medium) | I3 (industrial) |
| Logic Elements | — | 67,500 |
| Logic Array Blocks (LABs) | — | 2,700 |
| Embedded Memory (bits) | — | 2,699,264 |
| Core Voltage | — | 1.1 V (1.05 V to 1.15 V) |
| Operating Frequency | — | 500 MHz |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip FineLine BGA) |
| Ball Pitch | — | 1.0 mm |
| Temperature ng Junction na Operasyon | — | -40 C to +100 C |