EP3SL70F780I4L vs EP3SL50F780I4L Perbandingan
Perbandingan bersamaan detil EP3SL70F780I4L dari Intel dan EP3SL50F780I4L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SL70F780I4L | EP3SL50F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 47,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Paket | 780-ball FBGA (FineLine BGA) | 780-BBGA, FCBGA (29 mm) |
| Suhu Kerja | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | I4 | I4 |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Embedded Memory (bits) | — | 2,184,192 |
| User I/O Count | — | 488 |
| I/O Banks | — | 8 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Level MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |