EP3SL70F780I4L vs EP3SL50F780I4L Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I4L disebabkan oleh Intel dan EP3SL50F780I4L disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SL70F780I4L | EP3SL50F780I4L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Aktif |
| Family | Stratix III L | Stratix III L |
| Logic Elements | 67,500 | 47,500 |
| Logic Array Blocks (LABs) | 2,700 | — |
| Embedded Memory Bits | 2,699,264 | — |
| User I/O Pins | 488 | — |
| Kemasan | 780-ball FBGA (FineLine BGA) | 780-BBGA, FCBGA (29 mm) |
| Suhu Operasi | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | I4 | I4 |
| Power Variant | L (low static power) | — |
| Process Node | 40 nm | — |
| Configuration Method | Serial / Parallel / JTAG via Quartus II | — |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | None (logic/transceiver-less L variant) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount (BGA) |
| Status RoHS | Compliant | — |
| Embedded Memory (bits) | — | 2,184,192 |
| User I/O Count | — | 488 |
| I/O Banks | — | 8 |
| Process Technology | — | 65 nm CMOS |
| Core Voltage | — | 0.9 V |
| Lead-Free / RoHS | — | Yes (L suffix) |
| Aras MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Configuration Memory | — | SRAM-based, volatile |
| Design Suite | — | Quartus II / Quartus Prime (Stratix III support) |
| Device Sub-Family | — | Low-Power (L) |
| Country of Origin | — | [DATA_NEEDED: COO not specified in source data] |