EP4CE75F29C8L vs EP4CE75F29C7 Perbandingan
Perbandingan bersamaan detil EP4CE75F29C8L dari Intel dan EP4CE75F29C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE75F29C8L | EP4CE75F29C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Device Type | FPGA (Field-Programmable Gate Array) | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Suhu Kerja | 0C to 85C (commercial) | — |
| Paket | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29, 29 mm) |
| Ball Count | 780 | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Logic Elements (LEs) | — | 75 408 |
| Embedded Memory Bits | — | 2 810 880 (4.5 Mbit, M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 274 |
| Maximum User I/O | — | 426 |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 C to +85 C) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, Active Serial (AS), Passive Serial (PS) |
| Block Memory Type | — | M9K (9 Kbit blocks) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |