EP4CE75F29C8L vs EP4CE75F29C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CE75F29C8L disebabkan oleh Intel dan EP4CE75F29C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CE75F29C8L | EP4CE75F29C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV E | Cyclone IV E |
| Device Type | FPGA (Field-Programmable Gate Array) | Field Programmable Gate Array (FPGA) |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | — |
| Suhu Operasi | 0C to 85C (commercial) | — |
| Kemasan | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29, 29 mm) |
| Ball Count | 780 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Logic Elements (LEs) | — | 75 408 |
| Embedded Memory Bits | — | 2 810 880 (4.5 Mbit, M9K blocks) |
| Embedded Multipliers (18 x 18) | — | 274 |
| Maximum User I/O | — | 426 |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Commercial (0 C to +85 C) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Configuration Method | — | JTAG, Active Serial (AS), Passive Serial (PS) |
| Block Memory Type | — | M9K (9 Kbit blocks) |
| Design Tool | — | Intel Quartus Prime (Lite / Standard / Pro) |