EP4CGX50CF23C6N vs EP4CGX50CF23I7N Perbandingan
Perbandingan bersamaan detil EP4CGX50CF23C6N dari Intel dan EP4CGX50CF23I7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50CF23C6N | EP4CGX50CF23I7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX50 | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks (M9K) | 56 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 11 | — |
| Maximum User I/O | 290 | 290 |
| Transceivers | Up to 8 channels at 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm low-power CMOS | — |
| Paket | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Suhu Kerja | 0C to +85C (Commercial) | -40C to +100C (industrial, I7) |
| Speed Grade | C6 | — |
| Status RoHS | Compliant | Compliant (lead-free N suffix) |
| Embedded Memory Bits | — | 2,562,048 |
| Tipe Mounting | — | Surface Mount (BGA) |
| Configuration Modes | — | AS, PS, JTAG |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| Level MSL | — | [DATA_NEEDED: MSL level] |