EP4CGX50CF23C6N vs EP4CGX50CF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C6N sa pamamagitan ng Intel at EP4CGX50CF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C6N | EP4CGX50CF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX50 | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total Memory Bits | 2,562,048 bits | — |
| Embedded Memory Blocks (M9K) | 56 | — |
| Embedded 18x18 Multipliers | 132 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 11 | — |
| Maximum User I/O | 290 | 290 |
| Transceivers | Up to 8 channels at 3.125 Gbps | 8 channels, up to 3.125 Gbps |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Process Technology | 60 nm low-power CMOS | — |
| Packhaging | 484-ball FineLine BGA (FBGA-484) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Package Dimensions | 23 x 23 mm, 1.0 mm pitch | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | -40C to +100C (industrial, I7) |
| Speed Grade | C6 | — |
| Tindminan RoHS | Compliant | Compliant (lead-free N suffix) |
| Embedded Memory Bits | — | 2,562,048 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Configuration Modes | — | AS, PS, JTAG |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |