EP4CGX50DF27C6N vs EP4CGX50DF27C7N Perbandingan
Perbandingan bersamaan detil EP4CGX50DF27C6N dari Intel dan EP4CGX50DF27C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX50DF27C6N | EP4CGX50DF27C7N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Logic Array Blocks (LAB) | 3,118 | [DATA_NEEDED: LAB count for EP4CGX50] |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Yes (3.125 Gbps GX channels, package-dependent) |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | — |
| Paket | 672-ball FineLine BGA (FBGA) | 672-pin FBGA (FineLine BGA) |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Status RoHS | Compliant | Compliant |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Core Supply Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |