EP4CGX50DF27C6N vs EP4CGX50DF27C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27C6N sa pamamagitan ng Intel at EP4CGX50DF27C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF27C6N | EP4CGX50DF27C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | 49,888 |
| Logic Array Blocks (LAB) | 3,118 | [DATA_NEEDED: LAB count for EP4CGX50] |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | — |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | Yes (3.125 Gbps GX channels, package-dependent) |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | — |
| Packhaging | 672-ball FineLine BGA (FBGA) | 672-pin FBGA (FineLine BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Core Supply Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |