EP4CGX75CF23I7N vs EP4CGX75DF27C7 Perbandingan
Perbandingan bersamaan detil EP4CGX75CF23I7N dari Intel dan EP4CGX75DF27C7 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CGX75CF23I7N | EP4CGX75DF27C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | — |
| Series | EP4CGX75 (F23) | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (316 M9K blocks) | — |
| Embedded Multipliers (18x18) | 150 | — |
| User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PLLs | 8 | — |
| Paket | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 672-ball FBGA |
| Suhu Kerja | -40C to +100C (industrial I7 grade) | [DATA_NEEDED: operating temperature range] |
| Tipe Mounting | Surface Mount (FBGA) | Surface Mount |
| Process Node | 60 nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| Status RoHS | Lead-free (compliant per datasheet.com excerpt) | [DATA_NEEDED: RoHS status] |
| Level MSL | 3 (per typical Altera FBGA) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Tegangan Pemuat | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |