EP4CGX75CF23I7N vs EP4CGX75DF27C7 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4CGX75CF23I7N disebabkan oleh Intel dan EP4CGX75DF27C7 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4CGX75CF23I7N | EP4CGX75DF27C7 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Cyclone IV GX | — |
| Series | EP4CGX75 (F23) | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (316 M9K blocks) | — |
| Embedded Multipliers (18x18) | 150 | — |
| User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PLLs | 8 | — |
| Kemasan | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 672-ball FBGA |
| Suhu Operasi | -40C to +100C (industrial I7 grade) | [DATA_NEEDED: operating temperature range] |
| Jenis Pemasangan | Surface Mount (FBGA) | Surface Mount |
| Process Node | 60 nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| Status RoHS | Lead-free (compliant per datasheet.com excerpt) | [DATA_NEEDED: RoHS status] |
| Aras MSL | 3 (per typical Altera FBGA) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Tegangan Pemberi Arus | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |