EP4CGX75CF23I7N vs EP4CGX75DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23I7N sa pamamagitan ng Intel at EP4CGX75DF27C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75CF23I7N | EP4CGX75DF27C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Series | EP4CGX75 (F23) | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (316 M9K blocks) | — |
| Embedded Multipliers (18x18) | 150 | — |
| User I/O Pins | 290 | — |
| Transceivers | 8 channels up to 3.125 Gbps | — |
| PLLs | 8 | — |
| Packhaging | 484-FBGA (F23), 23 x 23 mm, 1.0 mm pitch | 672-ball FBGA |
| Temperature na Operasyon | -40C to +100C (industrial I7 grade) | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount (FBGA) | Surface Mount |
| Process Node | 60 nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, Fast Passive Parallel | — |
| Tindminan RoHS | Lead-free (compliant per datasheet.com excerpt) | [DATA_NEEDED: RoHS status] |
| Level ng MSL | 3 (per typical Altera FBGA) | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Volte ng Pagbibigay | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |