EP4SGX230HF35I4G vs EP4SGX360NF45C3 Perbandingan
Perbandingan bersamaan detil EP4SGX230HF35I4G dari Intel dan EP4SGX360NF45C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX230HF35I4G | EP4SGX360NF45C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 353,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Paket | 1152-ball FCBGA (HF35) | 1932-ball FC-FBGA (NF45) |
| Suhu Kerja | -40C to +100C (Industrial) | Commercial (C3 speed grade) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Status RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Tipe Mounting | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| Logic Array Blocks (LABs) | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Transceivers | — | Embedded multi-gigabit transceivers (GX) |
| Transceiver Data Rate | — | Up to 6.5 Gbps (per Stratix IV GX family) |
| Hard PCI Express Blocks | — | Yes (Gen1 / Gen2) |
| DSP Blocks | — | Dedicated variable-precision DSP blocks |
| Process Technology | — | 40 nm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |