EP4SGX230HF35I4G vs EP4SGX360NF45C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX230HF35I4G sa pamamagitan ng Intel at EP4SGX360NF45C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX230HF35I4G | EP4SGX360NF45C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 228,000 | 353,600 |
| Embedded Memory (Bits) | 17,544,192 | — |
| Embedded Memory (Mbit) | 17.5 Mbit | — |
| 18x18 Multipliers | 1,728 | — |
| User I/O Pins | 564 | — |
| Transceiver Channels | 8 (up to 8.5 Gbps) | — |
| Packhaging | 1152-ball FCBGA (HF35) | 1932-ball FC-FBGA (NF45) |
| Temperature na Operasyon | -40C to +100C (Industrial) | Commercial (C3 speed grade) |
| Core Voltage | 0.93 V | 0.9 V |
| Process Node | 40 nm | — |
| Hard PCIe IP Cores | PCIe Gen1/Gen2 (x1/x4/x8) | — |
| PLLs | 24 | — |
| LVDS Performance | 1,335 Mbit/s | — |
| Configuration Scheme | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | Surface Mount (flip-chip BGA) |
| Logic Array Blocks (LABs) | — | 14,144 |
| Embedded Memory (bits) | — | 23,105,536 |
| Maximum User I/O | — | 920 |
| Transceivers | — | Embedded multi-gigabit transceivers (GX) |
| Transceiver Data Rate | — | Up to 6.5 Gbps (per Stratix IV GX family) |
| Hard PCI Express Blocks | — | Yes (Gen1 / Gen2) |
| DSP Blocks | — | Dedicated variable-precision DSP blocks |
| Process Technology | — | 40 nm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |