EP4SGX360FF35C2XN vs EP4SGX360FF35I3 Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35C2XN dari Intel dan EP4SGX360FF35I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35C2XN | EP4SGX360FF35I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | I3 |
| Number of Transceivers | 24 | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate (max) | 8.5 Gbps | [DATA_NEEDED: Gbps] |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Paket | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (Flip-Chip) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | 0C to +85C (Commercial) | -40C to +100C |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Core Voltage | — | 0.9 V |
| Level MSL | — | [DATA_NEEDED: MSL] |