EP4SGX360FF35C2XN vs EP4SGX360FF35I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360FF35C2XN disebabkan oleh Intel dan EP4SGX360FF35I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360FF35C2XN | EP4SGX360FF35I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | 14,144 |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | I3 |
| Number of Transceivers | 24 | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate (max) | 8.5 Gbps | [DATA_NEEDED: Gbps] |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Kemasan | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (Flip-Chip) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Suhu Operasi | 0C to +85C (Commercial) | -40C to +100C |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Core Voltage | — | 0.9 V |
| Aras MSL | — | [DATA_NEEDED: MSL] |