EP4SGX360FF35C3 vs EP4SGX360FF35I3 Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35C3 dari Intel dan EP4SGX360FF35I3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35C3 | EP4SGX360FF35I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LE) | 353,600 | 353,600 |
| Logic Array Blocks (LAB) | 14,144 | — |
| Embedded Memory | 23,105,536 bits | [DATA_NEEDED: total Kbits] |
| User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) | 0.9 V |
| Suhu Hubung Kerja | 0 C to 85 C | — |
| Grade | Commercial | — |
| Paket | 1152-FBGA (35x35 mm), FCBGA | 1152-BBGA, FCBGA (Flip-Chip) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed/Package Grade | FF35 | — |
| Tipe Memori | TriMatrix (MLAB + M9K + M144K blocks) | — |
| DSP Blocks | Yes (dedicated) | — |
| Hard Memory Controller | DDR/DDR2/DDR3, QDRII+, RLDRAM II | — |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| LABs/CLBs | — | 14,144 |
| Total RAM Bits | — | 23,105,536 |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: Gbps] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Suhu Kerja | — | -40C to +100C |
| Speed Grade | — | I3 |
| Level MSL | — | [DATA_NEEDED: MSL] |