EP4SGX360FF35C3 vs EP4SGX360FF35I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35C3 sa pamamagitan ng Intel at EP4SGX360FF35I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FF35C3 | EP4SGX360FF35I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX FPGA | Stratix IV GX |
| Logic Elements (LE) | 353,600 | 353,600 |
| Logic Array Blocks (LAB) | 14,144 | — |
| Embedded Memory | 23,105,536 bits | [DATA_NEEDED: total Kbits] |
| User I/O Pins | 564 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) | 0.9 V |
| Temperature ng Junction na Operasyon | 0 C to 85 C | — |
| Grade | Commercial | — |
| Packhaging | 1152-FBGA (35x35 mm), FCBGA | 1152-BBGA, FCBGA (Flip-Chip) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed/Package Grade | FF35 | — |
| Uri ng Memory | TriMatrix (MLAB + M9K + M144K blocks) | — |
| DSP Blocks | Yes (dedicated) | — |
| Hard Memory Controller | DDR/DDR2/DDR3, QDRII+, RLDRAM II | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| LABs/CLBs | — | 14,144 |
| Total RAM Bits | — | 23,105,536 |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Number of Transceivers | — | [DATA_NEEDED: transceiver count] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: Gbps] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Temperature na Operasyon | — | -40C to +100C |
| Speed Grade | — | I3 |
| Level ng MSL | — | [DATA_NEEDED: MSL] |