EP4SGX360FF35I3 vs EP4SGX360FF35I4N Perbandingan
Perbandingan bersamaan detil EP4SGX360FF35I3 dari Intel dan EP4SGX360FF35I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360FF35I3 | EP4SGX360FF35I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | — |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | 23,105,536 |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | [DATA_NEEDED: exact transceiver count per datasheet] |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Suhu Kerja | -40C to +100C | -40C to +100C (Industrial, I4 grade) |
| Paket | 1152-BBGA, FCBGA (Flip-Chip) | — |
| Tipe Mounting | Surface Mount | Surface Mount |
| Speed Grade | I3 | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Level MSL | [DATA_NEEDED: MSL] | — |
| Number of Logic Elements / Cells | — | 353,600 |
| Number of LABs / CLBs | — | 14,144 |
| Number of I/O | — | 564 |
| Voltage - Supply | — | 0.9 V core |
| Paket / Case | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 x 35 mm |
| Supplier Device Package | — | FBGA-1152 |
| Lead Free / RoHS | — | Yes (Lead Free) |
| Clock Frequency (max) | — | 717 MHz |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel max Gbps per datasheet] |