EP4SGX360HF35C2 vs EP4SGX360KF40C2 Perbandingan

Perbandingan bersamaan detil EP4SGX360HF35C2 dari Intel dan EP4SGX360KF40C2 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX360HF35C2 EP4SGX360KF40C2
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif NRND
Series Stratix IV GX —
Family Stratix IV GX FPGA Stratix IV GX
Logic Elements (LEs) 353,600 —
LABs/CLBs 14,144 —
Number of I/O 564 (max 532 user I/O) —
Embedded Memory (bits) 23,105,536 —
Number of Logic Cells 353,600 —
Core Voltage 0.9 V 0.9 V
Process Technology 40 nm 40 nm
Transceivers Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) —
Package Type 1152-pin FC-FBGA —
Package Code HF35 (35x35 mm, 1.0 mm pitch) —
Tipe Mounting Surface Mount (Flip-Chip BGA) Surface Mount (flip-chip BGA)
Suhu Kerja 0C to +85C (commercial) 0C to +85C (commercial)
Status RoHS Compliant Compliant
Configuration JTAG / Active Serial (external config device) —
Design Tool Quartus II / Quartus Prime —
Logic Elements (LE) — 353,600
Adaptive Logic Modules (ALM) — 212,160 (estimated from LE)
Embedded Memory (Bits) — 23,105,536 (17.7 Mbits M20K)
User I/O Count — 744
Transceiver Count — Up to 24
Max Transceiver Data Rate — 8.5 Gbps
PCIe Hard IP — PCIe Gen2 x8 (Gen1 compatible)
DSP Blocks — 1,040 (variable precision)
Speed Grade — C2 (commercial)
Paket — 1517-ball FCBGA, 42.5 x 42.5 mm
Level MSL — MSL3 (per JEDEC J-STD-020)

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon