EP4SGX360HF35C2 vs EP4SGX360KF40C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360HF35C2 sa pamamagitan ng Intel at EP4SGX360KF40C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4SGX360HF35C2 EP4SGX360KF40C2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Series Stratix IV GX —
Family Stratix IV GX FPGA Stratix IV GX
Logic Elements (LEs) 353,600 —
LABs/CLBs 14,144 —
Number of I/O 564 (max 532 user I/O) —
Embedded Memory (bits) 23,105,536 —
Number of Logic Cells 353,600 —
Core Voltage 0.9 V 0.9 V
Process Technology 40 nm 40 nm
Transceivers Multi-gigabit serial transceivers (PCIe Gen2/XAUI/CEI-6G capable) —
Package Type 1152-pin FC-FBGA —
Package Code HF35 (35x35 mm, 1.0 mm pitch) —
Uri ng Pagpapasok Surface Mount (Flip-Chip BGA) Surface Mount (flip-chip BGA)
Temperature na Operasyon 0C to +85C (commercial) 0C to +85C (commercial)
Tindminan RoHS Compliant Compliant
Configuration JTAG / Active Serial (external config device) —
Design Tool Quartus II / Quartus Prime —
Logic Elements (LE) — 353,600
Adaptive Logic Modules (ALM) — 212,160 (estimated from LE)
Embedded Memory (Bits) — 23,105,536 (17.7 Mbits M20K)
User I/O Count — 744
Transceiver Count — Up to 24
Max Transceiver Data Rate — 8.5 Gbps
PCIe Hard IP — PCIe Gen2 x8 (Gen1 compatible)
DSP Blocks — 1,040 (variable precision)
Speed Grade — C2 (commercial)
Packhaging — 1517-ball FCBGA, 42.5 x 42.5 mm
Level ng MSL — MSL3 (per JEDEC J-STD-020)

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