EP4SGX360KF40C2 vs EP4SGX360KF40C3N Perbandingan
Perbandingan bersamaan detil EP4SGX360KF40C2 dari Intel dan EP4SGX360KF40C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4SGX360KF40C2 | EP4SGX360KF40C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm CMOS |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | C3 |
| Suhu Kerja | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Paket | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FC-FBGA (KF40) |
| Tipe Mounting | Surface Mount (flip-chip BGA) | — |
| Level MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Number of I/Os | — | 744 |
| Embedded Memory | — | 19.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,040 |
| Transceivers | — | 24 channels |
| Lead Free / RoHS | — | Yes / Compliant |