EP4SGX360KF40C2 vs EP4SGX360KF40C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP4SGX360KF40C2 disebabkan oleh Intel dan EP4SGX360KF40C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP4SGX360KF40C2 | EP4SGX360KF40C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Obsolete |
| Family | Stratix IV GX | Stratix IV GX |
| Process Technology | 40 nm | 40 nm CMOS |
| Logic Elements (LE) | 353,600 | — |
| Adaptive Logic Modules (ALM) | 212,160 (estimated from LE) | — |
| Embedded Memory (Bits) | 23,105,536 (17.7 Mbits M20K) | — |
| User I/O Count | 744 | — |
| Transceiver Count | Up to 24 | — |
| Max Transceiver Data Rate | 8.5 Gbps | 8.5 Gbps |
| PCIe Hard IP | PCIe Gen2 x8 (Gen1 compatible) | — |
| DSP Blocks | 1,040 (variable precision) | — |
| Core Voltage | 0.9 V | 0.9 V |
| Speed Grade | C2 (commercial) | C3 |
| Suhu Operasi | 0C to +85C (commercial) | 0C to +85C (Commercial) |
| Kemasan | 1517-ball FCBGA, 42.5 x 42.5 mm | 1517-ball FC-FBGA (KF40) |
| Jenis Pemasangan | Surface Mount (flip-chip BGA) | — |
| Aras MSL | MSL3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Number of I/Os | — | 744 |
| Embedded Memory | — | 19.7 Mbits |
| DSP Blocks (18x18 Multipliers) | — | 1,040 |
| Transceivers | — | 24 channels |
| Lead Free / RoHS | — | Yes / Compliant |