EP4SGX530KH40C2N vs EP4SGX530KH40C3 Perbandingan
Perbandingan bersamaan detil EP4SGX530KH40C2N dari Intel dan EP4SGX530KH40C3 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP4SGX530KH40C2N - 531K LEs Stratix IV GX FPGA, 1517-FCBGA | Intel
EP4SGX530KH40C2N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP4SGX530KH40C2N | EP4SGX530KH40C3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 531,200 | 531,200 |
| Logic Array Blocks (LABs) | 21,248 | — |
| Embedded Memory Bits | 28,033,024 | — |
| Adaptive Logic Modules (ALMs) | 212,480 | — |
| DSP Blocks | 24 | — |
| 18x18 Multipliers | 1,024 | — |
| Maximum User I/O Pins | 744 | — |
| Transceivers | Up to 48 (GX) | Up to 48 channels |
| Maximum Transceiver Data Rate | 8.5 Gbps | — |
| PCI Express Hard IP Blocks | 4 | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Paket | 1517-ball FCBGA (KH40) | 1517-BBGA, FCBGA |
| Tipe Mounting | Surface Mount (flip-chip BGA) | Surface Mount (BGA) |
| Suhu Kerja | -40C to +100C (industrial) | — |
| Status RoHS | Compliant | Compliant |
| Configurable Logic Blocks (CLBs) | — | 212,480 |
| Embedded Memory (bits) | — | 28,033,024 |
| Embedded Memory (Mbits) | — | 28,033,024 / 8 ≈ 3,504 KBytes |
| Maximum User I/O | — | 744 |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Hard PCIe Gen2 Endpoint | — | Yes |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: count] |
| PLLs | — | 12 (typical) |
| Package Pin Count | — | 1517 balls |
| Ball Pitch | — | 1.0 mm (typical for FCBGA-1517) |
| Process Node | — | 40 nm CMOS |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Speed Grade | — | C3 |