EP4SGX70DF29C4G vs EP4SGX70DF29I3G Perbandingan

Perbandingan bersamaan detil EP4SGX70DF29C4G dari Intel dan EP4SGX70DF29I3G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EP4SGX70DF29C4G EP4SGX70DF29I3G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Series Stratix IV GX Stratix IV GX
Family Stratix IV —
Logic Elements (LE) 72,600 72,600
Total Memory Bits 7,564,880 —
User I/O Count 372 —
Number of Transceivers 8 —
Transceiver Data Rate (max) 8.5 Gbps —
Package Type 780-BBGA, FCBGA 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip)
Package Code BGA DF29
Package Body Size 29 mm × 29 mm —
Ball Pitch 1.0 mm —
Process Node 40 nm —
Speed Grade C4 (commercial) -3
Suhu Kerja [DATA_NEEDED: Operating Temperature Range] —
Tipe Mounting Surface Mount Surface Mount (BGA)
Status RoHS Compliant Compliant
Process Technology — 40 nm
Embedded Memory Bits — 7,564,880 (about 7.5 Mbit)
Embedded Memory Blocks — 72600
Number of Logic Cells / Arrays — 372
Number of User I/O Pins — 372
Number of Transceiver Channels — [DATA_NEEDED: exact channel count for this device]
Transceiver Data Rate — [DATA_NEEDED: per-channel data rate]
Operating Temperature Grade — Industrial (I3)
Junction Temperature Range — -40C to +100C
Core Supply Voltage — 0.87 V to 0.93 V
Level MSL — [DATA_NEEDED: MSL rating]
Bebas Halogen — [DATA_NEEDED: halogen-free claim]

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