EP4SGX70DF29C4G vs EP4SGX70DF29I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX70DF29C4G sa pamamagitan ng Intel at EP4SGX70DF29I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX70DF29C4G | EP4SGX70DF29I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | — |
| Logic Elements (LE) | 72,600 | 72,600 |
| Total Memory Bits | 7,564,880 | — |
| User I/O Count | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| Package Type | 780-BBGA, FCBGA | 780-Ball FCBGA (Fine-pitch Chip-Scale BGA, flip-chip) |
| Package Code | BGA | DF29 |
| Package Body Size | 29 mm × 29 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Node | 40 nm | — |
| Speed Grade | C4 (commercial) | -3 |
| Temperature na Operasyon | [DATA_NEEDED: Operating Temperature Range] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Process Technology | — | 40 nm |
| Embedded Memory Bits | — | 7,564,880 (about 7.5 Mbit) |
| Embedded Memory Blocks | — | 72600 |
| Number of Logic Cells / Arrays | — | 372 |
| Number of User I/O Pins | — | 372 |
| Number of Transceiver Channels | — | [DATA_NEEDED: exact channel count for this device] |
| Transceiver Data Rate | — | [DATA_NEEDED: per-channel data rate] |
| Operating Temperature Grade | — | Industrial (I3) |
| Junction Temperature Range | — | -40C to +100C |
| Core Supply Voltage | — | 0.87 V to 0.93 V |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |
| Wala sa Halogen | — | [DATA_NEEDED: halogen-free claim] |