EPF10K250EGC599-1 vs EPF10K200EGC599-1 Perbandingan
Perbandingan bersamaan detil EPF10K250EGC599-1 dari Intel dan EPF10K200EGC599-1 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EPF10K250EGC599-1 | EPF10K200EGC599-1 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | NRND | Waktu Pembelian Terakhir |
| Product Type | FPGA (Field-Programmable Gate Array) | — |
| Series | FLEX 10K | — |
| Logic Elements | 40,960 | — |
| Equivalent Gates | 250,000 | — |
| Flip-Flops | 12,160 | — |
| User I/O Pins | 470 | — |
| Embedded Array Blocks (EAB) | 20 (2 Kbit each) | — |
| Paket | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) | — |
| Jumlah Pin | 599 | 599 |
| Suhu Kerja | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Tipe Mounting | Through-Hole (PGA) | Through-Hole (Socket or Solder) |
| Configuration | SRAM (volatile), serial/parallel EPROM | — |
| Process Node | 0.42 µm CMOS | — |
| I/O Standard Support | 5.0 V PCI, LVTTL, LVCMOS | — |
| Programming Interface | JTAG (IEEE 1149.1), passive serial | JTAG (IEEE 1149.1) |
| Level MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Status RoHS | unknown (ceramic HIPGA package historically non-RoHS) | [DATA_NEEDED: RoHS status of ceramic CPGA variant] |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 9,984 |
| Typical Gates | — | 200,000 |
| Embedded Array Blocks (EABs) | — | 470 |
| Total RAM Bits | — | 98,304 |
| Core Supply Voltage | — | 2.375 V to 2.625 V |
| I/O Voltage Tolerance | — | 5.0 V tolerant |
| Package Type | — | 599-BCPGA (Ceramic Pin Grid Array) |
| Package Dimensions | — | 62.48 x 62.48 mm |
| PLLs | — | 4 |