EPM2210F256C3N vs EPM570F256C5N Perbandingan
Perbandingan bersamaan detil EPM2210F256C3N dari Intel dan EPM570F256C5N dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210F256C3N | EPM570F256C5N |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Programmable Type | In System Programmable (JTAG, IEEE 1149.1) | — |
| Macrocells | 1700 | — |
| Logic Elements / Blocks | 2210 | — |
| Number of User I/Os | 204 | — |
| Maximum Propagation Delay (tPD) | 7 ns | — |
| Maximum Internal Frequency (fMAX) | 304 MHz | — |
| Internal Supply Voltage | 2.5 V / 3.3 V (on-chip regulator allows single 3.3 V rail) | 2.5 V / 3.3 V |
| I/O Standard Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS (MultiVolt) | — |
| User Flash Memory | 8 Kbits | 8 Kbits |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Suhu Hubung Kerja | 0 C to 85 C (commercial, TJ suffix 'C') | — |
| Paket | 256-ball FineLine BGA (FBGA), 17 x 17 mm, 1.0 mm pitch | 256-FBGA (FineLine BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Process Technology | 0.18 um flash CMOS | 0.18 um |
| Status RoHS | Compliant (per DigiKey product page) | — |
| Level MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Family | — | MAX II |
| Logic Elements | — | 570 |
| Number of Macrocells | — | 440 |
| User I/O Count | — | 160 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Maximum Operating Frequency | — | 304 MHz |
| Program Memory Type | — | Non-volatile Flash |
| MultiVolt I/O Support | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Programming Interface | — | JTAG (IEEE 1149.1), in-system |
| Suhu Kerja | — | 0C to 85C (TJ) |