EPM2210F324C3N vs EPM2210GF324C4N Perbandingan
Perbandingan bersamaan detil EPM2210F324C3N dari Intel dan EPM2210GF324C4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210F324C3N | EPM2210GF324C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | MAX II | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | — |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) | — |
| Global Clock Networks | 4 | — |
| Core Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Paket | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (GF324) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) | IEEE 1149.1 JTAG (ISP) |
| Suhu Kerja | 0C to +85C (commercial) | — |
| Process Technology | 6-layer-metal CMOS, flash-based | 0.18 µm 6-layer-metal flash |
| Status RoHS | Lead-free (per datasheet) | Compliant |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) | — |
| Family | — | MAX II |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements | — | 2,210 |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |