EPM2210F324C3N vs EPM2210GF324C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210F324C3N sa pamamagitan ng Intel at EPM2210GF324C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM2210F324C3N | EPM2210GF324C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | MAX II | — |
| Logic Elements (LE) | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Maximum User I/Os | 272 | — |
| Pin-to-Pin Delay (tPD1) | 7 ns (commercial speed grade) | — |
| Global Clock Networks | 4 | — |
| Core Voltage | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Packhaging | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) | 324-ball FineLine BGA (GF324) |
| Configuration Memory | On-chip flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG 1149.1 (in-system programmable, ISP) | IEEE 1149.1 JTAG (ISP) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Process Technology | 6-layer-metal CMOS, flash-based | 0.18 µm 6-layer-metal flash |
| Tindminan RoHS | Lead-free (per datasheet) | Compliant |
| Design Software | Quartus II / Quartus Prime (Intel FPGA) | — |
| Family | — | MAX II |
| Device Type | — | CPLD (Complex Programmable Logic Device) |
| Logic Elements | — | 2,210 |
| User I/Os (max) | — | 272 |
| Supply Voltage - Core (VCCINT) | — | 1.8 V |
| Maximum Internal Frequency | — | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | — | 7.0 ns (C4 speed grade) |
| Operating Temperature (commercial) | — | 0 °C to +85 °C |