EPM2210GF324C4N vs EPM2210F324C3N Perbandingan
Perbandingan bersamaan detil EPM2210GF324C4N dari Intel dan EPM2210F324C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210GF324C4N | EPM2210F324C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal CMOS, flash-based |
| Paket | 324-ball FineLine BGA (GF324) | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Status RoHS | Compliant | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 7 ns (commercial speed grade) |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |