EPM2210GF324C4N vs EPM2210F324C3N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM2210GF324C4N disebabkan oleh Intel dan EPM2210F324C3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM2210GF324C4N | EPM2210F324C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | — |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 6-layer-metal CMOS, flash-based |
| Kemasan | 324-ball FineLine BGA (GF324) | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG 1149.1 (in-system programmable, ISP) |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Status RoHS | Compliant | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Logic Elements (LE) | — | 2,210 |
| Maximum User I/Os | — | 272 |
| Pin-to-Pin Delay (tPD1) | — | 7 ns (commercial speed grade) |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Suhu Operasi | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |