EPM2210GF324C5 vs EPM2210F324C3N Perbandingan
Perbandingan bersamaan detil EPM2210GF324C5 dari Intel dan EPM2210F324C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EPM2210GF324C5 - MAX II 2210 LE CPLD, 324-BGA, 5ns | Intel/Altera
EPM2210GF324C5 ⚠ Waktu Beli Terakhir
Perbandingan Spesifikasi
| Parameter Umum | EPM2210GF324C5 | EPM2210F324C3N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Waktu Pembelian Terakhir | Aktif |
| Family | MAX II | — |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | 2,210 |
| Equivalent Macrocells | 1,700 | 1,700 |
| Maximum User I/Os | 272 | 272 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | 7 ns (commercial speed grade) |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | 6-layer-metal CMOS, flash-based |
| Suhu Hubung Kerja | 0C to +85C (commercial) | — |
| Paket | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| Tipe Mounting | Surface Mount (BGA) | — |
| Status RoHS | Compliant (lead-free) | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG 1149.1 (in-system programmable, ISP) |
| Suhu Kerja | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |