EPM2210GF324C5 vs EPM2210F324C3N 比較
詳細並排比較 EPM2210GF324C5 由 Intel 與 EPM2210F324C3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPM2210GF324C5 | EPM2210F324C3N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | MAX II | — |
| Device Name | EPM2210 | — |
| Logic Elements (LE) | 2,210 | 2,210 |
| Equivalent Macrocells | 1,700 | 1,700 |
| Maximum User I/Os | 272 | 272 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Pin-to-Pin Delay (tPD1) | 5 ns (C5 speed grade) | 7 ns (commercial speed grade) |
| Internal Performance | 304 MHz | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) - MultiVolt | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 6-layer-metal flash, 0.18 um | 6-layer-metal CMOS, flash-based |
| 工作接面溫度 | 0C to +85C (commercial) | — |
| 封裝 | 324-ball FineLine BGA (GF324), 1.0 mm pitch, 19 x 19 mm | FBGA-324 (324-ball FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| In-System Programmability | JTAG (IEEE 1149.1) | — |
| 安裝類型 | Surface Mount (BGA) | — |
| RoHS 狀態 | Compliant (lead-free) | Lead-free (per datasheet) |
| Device Family | — | MAX II |
| Global Clock Networks | — | 4 |
| Core Voltage | — | 1.8 V |
| MultiVolt I/O Support | — | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V |
| Configuration Memory | — | On-chip flash (non-volatile, instant-on) |
| Programming Interface | — | JTAG 1149.1 (in-system programmable, ISP) |
| 工作溫度 | — | 0C to +85C (commercial) |
| Design Software | — | Quartus II / Quartus Prime (Intel FPGA) |