EPM570F256C3N vs EPM570ZF256C7N Perbandingan

Perbandingan bersamaan detil EPM570F256C3N dari Intel dan EPM570ZF256C7N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM570F256C3N EPM570ZF256C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II —
Logic Elements (LEs) 570 —
Equivalent Macrocells 440 —
User Flash Memory (UFM) 8 Kbits —
Maximum Operating Frequency 304 MHz 201 MHz (internal)
Process Technology 0.18 um, 6-layer-metal flash CMOS 0.18 µm flash-based CMOS
Core Voltage 2.5 V / 3.3 V —
I/O Voltage Support (MultiVolt) 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Paket 256-ball FBGA (FineLine BGA) —
User I/O Count [DATA_NEEDED: confirm exact user-IO count for F256 package] —
Operating Temperature (C3 grade) 0 C to +85 C (commercial) —
Programming Interface JTAG (IEEE 1532 / IEEE 1149.1) + ISP JTAG (IEEE 1149.1)
Tipe Mounting Surface Mount Surface Mount
Level MSL [DATA_NEEDED: MSL level not stated in provided data] —
Status RoHS Compliant (per DigiKey listing) Compliant
Lead-Free Yes (per suffix 'N' convention) —
Typical Macroscopic Functions Glue logic, bus bridging, I/O expansion, power sequencing —
Series — MAX II
Programmable Type — In System Programmable
Macro Cells — 440
Logic Elements (LE) — 440
Embedded Flash Memory — 8 Kbit
Pin-to-Pin Logic Delay (tPD) — 9 ns
Maximum User I/O Pins — 160
Supply Voltage - Internal (VCCINT) — 1.71 V to 1.89 V
I/O Bank Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Supplier Device Package — 256-MBGA (11x11 mm)
Package Type Code — 256-FBGA / 256-TFBGA
Ball Pitch — 1.0 mm
Rentang Suhu Kerja — 0 °C to +85 °C (commercial, suffix 'C')
Lead-Free Status — Lead free

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