EPM570F256C3N vs EPM570ZF256C7N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570F256C3N disebabkan oleh Intel dan EPM570ZF256C7N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPM570F256C3N EPM570ZF256C7N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II —
Logic Elements (LEs) 570 —
Equivalent Macrocells 440 —
User Flash Memory (UFM) 8 Kbits —
Maximum Operating Frequency 304 MHz 201 MHz (internal)
Process Technology 0.18 um, 6-layer-metal flash CMOS 0.18 µm flash-based CMOS
Core Voltage 2.5 V / 3.3 V —
I/O Voltage Support (MultiVolt) 1.5 V, 1.8 V, 2.5 V, 3.3 V —
Kemasan 256-ball FBGA (FineLine BGA) —
User I/O Count [DATA_NEEDED: confirm exact user-IO count for F256 package] —
Operating Temperature (C3 grade) 0 C to +85 C (commercial) —
Programming Interface JTAG (IEEE 1532 / IEEE 1149.1) + ISP JTAG (IEEE 1149.1)
Jenis Pemasangan Surface Mount Surface Mount
Aras MSL [DATA_NEEDED: MSL level not stated in provided data] —
Status RoHS Compliant (per DigiKey listing) Compliant
Lead-Free Yes (per suffix 'N' convention) —
Typical Macroscopic Functions Glue logic, bus bridging, I/O expansion, power sequencing —
Series — MAX II
Programmable Type — In System Programmable
Macro Cells — 440
Logic Elements (LE) — 440
Embedded Flash Memory — 8 Kbit
Pin-to-Pin Logic Delay (tPD) — 9 ns
Maximum User I/O Pins — 160
Supply Voltage - Internal (VCCINT) — 1.71 V to 1.89 V
I/O Bank Voltages — 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt)
Supplier Device Package — 256-MBGA (11x11 mm)
Package Type Code — 256-FBGA / 256-TFBGA
Ball Pitch — 1.0 mm
Gambaran Suhu Operasi — 0 °C to +85 °C (commercial, suffix 'C')
Lead-Free Status — Lead free

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