EPM570GF256C5 vs EPM570GF256C4 Perbandingan
Perbandingan bersamaan detil EPM570GF256C5 dari Intel dan EPM570GF256C4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM570GF256C5 | EPM570GF256C4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 76 | 212 |
| User Flash Memory (UFM) | 8 Kbits | — |
| Pin-to-Pin Logic Delay | 5.4 ns (tPD1, -5 speed grade) | — |
| Maximum Operating Frequency | 201.1 MHz (fCNT, internal) | — |
| Supply Voltage - Core | 1.8 V (internal LDO) | — |
| Supply Voltage - I/O (VCCIO) | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Suhu Kerja | -40 C to +125 C | 0 °C to +85 °C (commercial) |
| Paket | 256-ball FineLine BGA, 11 x 11 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron flash CMOS | 0.18 µm CMOS, flash-based configuration |
| Configuration | Non-volatile flash, instant-on (ISP) | — |
| Program Memory Type | Flash (internal) | — |
| JTAG Support | Yes (IEEE 1149.1) | IEEE 1149.1 boundary-scan + ISP |
| Status RoHS | Compliant (lead-free FBGA) | Lead-free, RoHS compliant |
| Logic Family | CMOS | — |
| Logic Elements (LEs) | — | 570 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Ball Pitch | — | 1.0 mm |
| Tipe Mounting | — | Surface Mount |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |