H5AN4G8NBJR-VKIR vs H5AN4G8NBJR-UHI Perbandingan
Perbandingan bersamaan detil H5AN4G8NBJR-VKIR dari SK hynix dan H5AN4G8NBJR-UHI dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5AN4G8NBJR-VKIR | H5AN4G8NBJR-UHI |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gb | 4 Gbit |
| Organisasi | 512M x 8 | 512M x 8 |
| Laju Data | 2666 Mbps per pin | 2400 MT/s |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Paket | 78-ball FBGA | FBGA-78 (78-ball fine-pitch BGA) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Operating Temperature (Industrial) | -40C to +85C (case) | — |
| Extended Temperature Range | +85C to +95C (case, per datasheet conditions) | — |
| Technology | CMOS DRAM | — |
| Product Family | H5AN4G4/6/8NBJR series | — |
| Speed Grade Code | -VKI | — |
| Packing Suffix | R (Tape & Reel) | — |
| VPP Supply | [DATA_NEEDED: VPP supply voltage] | — |
| Latensi CAS | [DATA_NEEDED: CAS latency] | [DATA_NEEDED: CAS latency at DDR4-2400] |
| Package Dimensions | [DATA_NEEDED: package dimensions] | — |
| Refresh | [DATA_NEEDED: refresh interval specification] | Self-refresh and auto-refresh support |
| Speed Grade | — | DDR4-2400 (PC4-19200) |
| Grade | — | Industrial (-UHI suffix) |
| Antarmuka | — | JEDEC DDR4 SDRAM |
| Bank Architecture | — | DDR4 bank group architecture |
| Termination | — | On-die termination (ODT) |
| Suhu Kerja | — | [DATA_NEEDED: operating temperature range] |
| Status RoHS | — | [DATA_NEEDED: RoHS status] |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |