H5AN8G8NAFR-VKC vs H5AN8G8NAFR-UHCR Perbandingan
Perbandingan bersamaan detil H5AN8G8NAFR-VKC dari SK hynix dan H5AN8G8NAFR-UHCR dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5AN8G8NAFR-VKC | H5AN8G8NAFR-UHCR |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gb | 8 Gbit |
| Organisasi | 1G x 8 | 1G x 8 |
| Speed Grade | DDR4-2666 (VKC bin) | — |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Antarmuka | SSTL12 | CMOS, synchronous DDR4 |
| Burst Length | 8 (BL8) | — |
| Bank Group Architecture | Supported (per DDR4 JEDEC architecture) | — |
| On-Die Termination (ODT) | Yes | — |
| DLL | Yes (DLL for output skew control) | — |
| Paket | 78-ball FBGA | FBGA-78 (PBGA78) |
| Tipe Mounting | Surface Mount | Surface Mount |
| Suhu Kerja | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Status RoHS | Compliant (Lead-Free & Halogen-Free) | Compliant (Lead-Free & Halogen-Free) |
| Process Technology | CMOS | — |
| Recommended Application | Main memory requiring large density and high bandwidth | — |
| Laju Data | — | 2400 Mbps/pin (PC2400) |
| Packing Suffix | — | R = Tape & Reel |
| Speed Grade Code | — | -UH |
| Generation Family | — | H5AN8GxNAFR-xxC (DDR4) |
| Application Class | — | Main memory / high bandwidth |
| Latensi CAS | — | [DATA_NEEDED: CAS latency (CL)] |
| Refresh Rate | — | [DATA_NEEDED: refresh specification] |
| Level MSL | — | [DATA_NEEDED: moisture sensitivity level] |