H5ANAG6NCR-UHC vs H5ANAG6NCJR-XN Perbandingan
Perbandingan bersamaan detil H5ANAG6NCR-UHC dari SK hynix dan H5ANAG6NCJR-XN dari SK hynix. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | H5ANAG6NCR-UHC | H5ANAG6NCJR-XN |
|---|---|---|
| Merek | SK hynix | SK hynix |
| Kategori | Mobile LPDDR4 | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Tipe Memori | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gb (2 GB) | — |
| Organisasi | 1G x 16 | 1G x 16 |
| Antarmuka | CMOS, Double Data Rate IV | — |
| Paket | FBGA-96 (PBGA-96) | FBGA-96 (96-ball) |
| Die Revision | C | — |
| Speed Grade | [DATA_NEEDED: Speed grade / data rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | 1.14 V to 1.26 V |
| Suhu Kerja | [DATA_NEEDED: Operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Configuration | 1 Channel, 1 Rank | — |
| Refresh | [DATA_NEEDED: Refresh scheme] | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Status RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Factory Packing Quantity | [DATA_NEEDED: Standard packing quantity] | — |
| Application | Main memory, embedded computing, industrial controllers | — |
| Density | — | 16 Gbit (1G x 16) |
| Laju Data | — | 3200 Mbps/pin (DDR4-3200) |
| Package Width | — | 8 mm |
| Auto Self-Refresh | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Data Mask (DM) | — | Yes |
| Dynamic On-Chip Termination (ODT) | — | Yes |
| ZQ Calibration | — | Yes |
| CRC (Command/Address) | — | Yes |
| Write Leveling | — | Yes |
| Maximum Standby Current | — | 0.074 A (per Vyrian listing) |
| Latensi CAS | — | [DATA_NEEDED: CAS latency for -XN speed grade] |